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Memory Technology Device
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21	qctconnect.com QUALCOMM CONFIDENTIAL AND PROPRIETARY Roadmap for Design and EDA Infrastructure for 3D Products Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:30:09 Semiconductor device fabrication Technology Three-dimensional integrated circuit Interposer Qualcomm Dynamic random-access memory Back end of line Application-specific integrated circuit Through-silicon via Integrated circuits Electronics Electronic engineering
22	LICENCE AGREEMENT FOR THE USE OF SEA SURFACE TEMPERATURE DATA Add to Reading List Source URL: moana.earthinsite.com Language: English GPS GPS navigation device Global Positioning System Nautical chart Memory map Sea surface temperature Technology Navigation Cartography
23	LICENCE AGREEMENT FOR THE USE OF SEA SURFACE TEMPERATURE DATA Add to Reading List Source URL: aqua.earthinsite.com Language: English - Date: 2011-03-07 07:14:03 GPS GPS navigation device Global Positioning System Nautical chart Memory map Sea surface temperature Technology Navigation Cartography
24	Next Generation Stacked Memory Systems Alok Gupta NVIDIA, Santa Clara, CA 1 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:54:47 Dynamic random-access memory Electronic engineering Interposer Semiconductor device fabrication Technology Through-silicon via Computer memory Integrated circuits Electronics
25	3D IC WORKING GROUP MEETING JULY 17, 2013 3D IC Working Group Meeting Agenda  2:00 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Electronic engineering Computer memory Technology Fabless semiconductor companies Three-dimensional integrated circuit Back end of line Rambus Dynamic random-access memory Interposer Semiconductor device fabrication Electronics Integrated circuits
26	3D IC WORKING GROUP MEETING JANUARY 21, 2015 3D IC Working Group Meeting Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:52:24 Integrated circuits Technology Semiconductor device fabrication Three-dimensional integrated circuit Application-specific integrated circuit Cisco Systems ATI Technologies Dynamic random-access memory Nvidia Electronic engineering Electronics Fabless semiconductor companies
27	Connected Device Platform Security: A Framework for Managing Device Features as a Service Most modern devices are now becoming “connected” Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-29 14:54:17 Digital rights management Stock-keeping unit USB flash drive High-bandwidth Digital Content Protection Computer hardware Technology Computer memory Rambus Cryptography
28	A Comparison of 3D Package Designs: Traditional Organic Substrates and Advanced Silicon Interposers GSA 3DIC Stacking Working Group Meeting July 17, 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:15 Integrated circuits Electronic engineering Technology Fabless semiconductor companies Rambus Three-dimensional integrated circuit Dynamic random-access memory Interposer Back end of line Computer memory Electronics Semiconductor device fabrication
29	Microsoft Word - Preventing SDRAM Device Lockup.doc Add to Reading List Source URL: ftp1.digi.com Language: English - Date: 2006-02-11 14:54:28 Dynamic random-access memory Electronics DDR SDRAM Technology DDR3 SDRAM SDRAM Computer memory Synchronous dynamic random-access memory
30	TN-13-23: M29F Flash Memory Power Guidelines Introduction Technical Note How to Power On and Power Off the M29F Flash Memory Device Introduction Add to Reading List Source URL: www.micron.com Language: English - Date: 2013-03-27 13:14:10 Semiconductor companies Flash memory Micron Technology Power supply Computing Digital media Computer hardware Computer memory Non-volatile memory